We have 12 years of experience in the research and development of O2 plasma cleaning equipment. This product is used for large-scale continuous production, suitable for products of various shapes, high versatility.
| Item | Parameter |
|---|---|
| Input Voltage | AC380V (3 phase) |
| Output Power | 500 W- 1000 W |
| Frequency | 40 kHz / 13.56 MHz |
| Cavity Volume | 30 L |
| Cavity Size | 350*320*320mm |
| Size(L*W*H) | 870*740*1540mm |
| Cavity Material | 316 stainless steel / aluminum alloy |
| Weight | 300 kg |
| Gas Used | Two-way process gas configuration: Air、N2、O2、Ar（optional） |
| Electrode of Plies | 5th floor |
O2 plasma cleaner for surface activation and cleaning of wafers, IC chips, semiconductor wafers
High- density metal material, polymer material bonding pre-treatment
Remove the organic film of optical glass
| Standard Package | Wooden case package and pallet |
| Delivery Time | 15-30 working days |
Fari was founded in 2011, is a professional manufacturing enterprise specializing in the research and development, production, sales and promotion of vacuum plasma cleaner and atmospheric plasma surface treatment technology equipment.