GD-30 Plasma Cleaning Machine is consist of the plasma cleaner host and a vacuum pump. The vacuum cavity size is 350(L)*320(W)*320(H) mm, and the equipment size is 870(L)*740(W)*1540(H) mm. The inner chamber including 5 tray. What’s more, we can customized the layer, cavity size and the power frequency with customers. With PLC and touch screen control, it’s very convenient. And it can be used for large-scale continuous production and various of products.
Photoresist is refers to a resist etching film material whose solubility changes through irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, etc. During surface processing of semiconductor materials, if a suitable selective photoresist is used, the desired image can be obtained on the surface. When the latter layer is processed, the photoresist after the previous use needs to be completely removed.
FARI GD-30 vacuum plasma cleaner with the 13.56 Mhz can remove the photoresist thoroughly and won’t be damaged material surface. At the same time, the wafer surface wettability is improved that better for the subsequent process.
Fangrui technology focusing on plasma 11 years, we have many experience about plasma cleaning in semiconductor, it is our pleasure discuss with you more detail about this process. Welcome sent us inquiry if you are interested in our device.
